The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2005
Filed:
Nov. 12, 2003
Christy Mei-chu Woo, Cupertino, CA (US);
Connie Pin-chin Wang, Menlo Park, CA (US);
Darrell M. Erb, Los Altos, CA (US);
Christy Mei-Chu Woo, Cupertino, CA (US);
Connie Pin-Chin Wang, Menlo Park, CA (US);
Darrell M. Erb, Los Altos, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
High reliable copper interconnects are formed with copper or a low resistivity copper alloy filling relatively narrow openings and partially filling relatively wider openings and a copper alloy having improved electromigration resistance selectively deposited in the relatively wider openings. The filled openings are recessed and a metal capping layer deposited followed by CMP. The metal capping layer prevents diffusion along the copper-capping layer interface while the copper alloy filling the relatively wider openings impedes electromigration along the grain boundaries.