The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2005

Filed:

Mar. 07, 2001
Applicants:

Kohji Shinomiya, Tokyo, JP;

Yasuyuki Endo, Tokyo, JP;

Shinsuke Igarashi, Chiba-ken, JP;

Inventors:

Kohji Shinomiya, Tokyo, JP;

Yasuyuki Endo, Tokyo, JP;

Shinsuke Igarashi, Chiba-ken, JP;

Assignees:

Renesas Technology Corp., Tokyo, JP;

Seiko Precision Inc., Chiba-Ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N005/225 ;
U.S. Cl.
CPC ...
Abstract

A solid-state image pickup apparatus includes a solid-state image pickup device having a layer of microlenses above a color filter. The solid-state image pickup device is mounted on a side of a flexible printed circuit board by flip-chip bonding, opposite the opening. An adhesive in a gap between the solid-state image pickup device and the flexible printed circuit board strengthens the apparatus. The distance between the edge of the microlens layer and the edge of the flexible printed circuit board defining the opening and nearest to the microlens layer is 2.5 to 10 times wider than the gap between the solid-state image pickup device and the flexible printed circuit board.


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