The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2005
Filed:
Apr. 01, 2003
Yutaka Kaneda, Kanuma, JP;
Keiichi Naito, Kanuma, JP;
Toshihiro Shinohara, Kanuma, JP;
Sony Corporation, Tokyo, JP;
Sony Chemicals Corp., Tokyo, JP;
Abstract
Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching maskis formed on a bump-forming surfaceof a metal foilwhich has a thickness that is the sum of the thickness tof the wiring circuitand the height tof the bumpswhich are to be formed on the wiring circuit(tt), and then the bumpsare formed by half-etching the metal foilto a depth corresponding to the desired bump height tfrom the bump-formation etching maskside, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.