The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2005
Filed:
Jun. 18, 2003
Applicants:
Osamu Yamazaki, Saitama, JP;
Kazuyoshi Ebe, Shiraoka-machi, JP;
Inventors:
Osamu Yamazaki, Saitama, JP;
Kazuyoshi Ebe, Shiraoka-machi, JP;
Assignee:
LINTEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B031/18 ; H01L021/02 ; H01L021/60 ; C09J007/02 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor device, which is obtained by sticking an adhesive sheetcomprising a base materialan adhesive agent layerformed on the base materialand conductor bodiesburied in the adhesive agent layerto a semiconductor wafer, and removing the base material from the adhesive agent layer of the adhesive sheet. The adhesive agent layerand a substrate are then aligned and the semiconductor wafer and the substrate are adhered via the adhesive agent layerto avoid defects caused by fluidity of an under filling material.