The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2005
Filed:
Dec. 08, 2003
James Christopher Matayabas, Jr., Chandler, AZ (US);
James Christopher Matayabas, Jr., Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A method of constructing a microelectronic assembly as provided. A mold piece is locating over a microelectronic die carrying an integrated circuit. An encapsulant is injected into a space defined between surfaces of the mold piece and the microelectronic die. The encapsulant includes a liquid phase epoxy and a solid phase catalyst compound when injected. The encapsulant mixture is heated in the space to a temperature where the catalyst compound becomes a liquid and cures the epoxy. The catalyst compound may, for example, be polystyrene and the catalyst may be diphenyl phosphine. The catalyst compound is then heated to above its glass transition temperature so that the diphenyl phosphine is released from the polystyrene. The diphenyl phosphine then cures the epoxy. The epoxy is preferably a liquid at room temperature.