The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2005
Filed:
Apr. 20, 2004
Shyh-ming Chang, Hsinchu, TW;
Yuan-chang Huang, Banciao, TW;
Wen-chih Chen, Hsinchu, TW;
Sheng-shu Yang, Hsinchu, TW;
Shyh-Ming Chang, Hsinchu, TW;
Yuan-Chang Huang, Banciao, TW;
Wen-Chih Chen, Hsinchu, TW;
Sheng-Shu Yang, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A bonding structure with compliant bumps includes a stopper structure and a protection layer. Compliant bumps include at least a polymer bump, a metal layer and a surface conductive layer. Both the stopper structure and protection layer are formed with polymer bumps and metal layer. Compliant bumps provide bonding pad and conductive channel. Stoppers are used to prevent compliant bumps from crushing for overpressure in bonding process. The protection layer provides functions of grounding and shielding. The stoppers can be outside or connected with the compliant bumps. The protection layer has thickness smaller than the stopper structure and compliant bumps. It can be separated or connected with stoppers.