The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2005

Filed:

Jun. 16, 2003
Applicants:

Gil Zilber, Ramat Gan, IL;

Reuven Katraro, Rishon le Zion, IL;

Julia Aksenton, Jerusalem, IL;

Vage Oganesian, Bet-Shemesh, IL;

Inventors:

Gil Zilber, Ramat Gan, IL;

Reuven Katraro, Rishon le Zion, IL;

Julia Aksenton, Jerusalem, IL;

Vage Oganesian, Bet-Shemesh, IL;

Assignee:

Shellcase Ltd., Jerusalem, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/02 ; H01L023/495 ;
U.S. Cl.
CPC ...
Abstract

An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an active surface formed on the first generally planar surface, at least one chip scale packaging layer formed over the active surface and at least one electrical contact formed over the at least one chip scale packaging layer, the at least one electrical contact being connected to circuitry on the active surface by at least one pad formed on the first generally planar surface.


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