The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2005

Filed:

Aug. 20, 2004
Applicants:

Tingkai LI, Vancouver, WA (US);

Wei-wei Zhuang, Vancouver, WA (US);

Lawrence J. Charneski, Vancouver, WA (US);

David R. Evans, Beaverton, OR (US);

Sheng Teng Hsu, Camas, WA (US);

Inventors:

Tingkai Li, Vancouver, WA (US);

Wei-Wei Zhuang, Vancouver, WA (US);

Lawrence J. Charneski, Vancouver, WA (US);

David R. Evans, Beaverton, OR (US);

Sheng Teng Hsu, Camas, WA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/20 ;
U.S. Cl.
CPC ...
Abstract

A method of fabricating a PCMO thin film at low temperature for use in a RRAM device includes preparing a PCMO precursor; preparing a substrate; placing the substrate into a MOCVD chamber; introducing the PCMO precursor into the MOCVD chamber to deposit a PCMO thin film on the substrate; maintaining a MOCVD vaporizer at between about 240° C. to 280° C. and maintaining the MOCVD chamber at a temperature of between about 300° C. to 400° C.; removing the PCMO thin-film bearing substrate from the MOCVD chamber; and completing the RRAM device.


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