The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2005

Filed:

May. 09, 2001
Applicants:

Seiichi Hayashi, Tokyo, JP;

Jimpei Harada, Tokyo, JP;

Tetsuo Kikuchi, Tokyo, JP;

Kazuhiko Omote, Tokyo, JP;

Katsuhiko Inaba, Tokyo, JP;

Inventors:

Seiichi Hayashi, Tokyo, JP;

Jimpei Harada, Tokyo, JP;

Tetsuo Kikuchi, Tokyo, JP;

Kazuhiko Omote, Tokyo, JP;

Katsuhiko Inaba, Tokyo, JP;

Assignee:

Rigaku Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N023/20 ;
U.S. Cl.
CPC ...
Abstract

The thin film deposition system for depositing a thin film on the surface of substrates disposed in a sealed thin film deposition furnace comprises a measuring unit at a site communicating with the thin film deposition furnace, the measuring unit comprising a thin film deposition sample substrate for allowing a thin film substance flowing in from the thin film deposition furnace to adhere while X-ray incidence and extraction windows being provided on the side walls of the measuring unit, wherein X-ray is irradiated on the thin film deposition sample substrate in the measuring unit through the X-ray incidence window by means of a thin film measuring unit provided at the outside of the thin film deposition furnace, and the X-ray reflected from the thin film deposition sample substrate is sensed through the X-ray extraction window.


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