The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2005

Filed:

Oct. 30, 2000
Applicants:

Juan Exposito, St. Nazaire les Eymes, FR;

Remi Brechignac, Grenoble, FR;

Inventors:

Juan Exposito, St. Nazaire les Eymes, FR;

Remi Brechignac, Grenoble, FR;

Assignee:

STMicroelectronics S.A., Montrouge, FR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L031/0203 ; H01L023/04 ; H01L023/043 ; H01L021/52 ;
U.S. Cl.
CPC ...
Abstract

Optical semiconductor package and its fabrication process, in which: a rear face of a first semiconductor component () such as a microprocessor is supported by a front face of an electrical connection support plate (); a rear face of a second semiconductor component () is fixed to a front face of the said first component () and a front face of this second component has an optical sensor (); first electrical connection means () connect the said first component to the front face of the said support plate; second electrical connection means () connect the said second component to the front face of the said support plate; means () ensure encapsulation of the said components stacked on the said support plate and of the said electrical connection means, the said encapsulation means being made from a transparent material which is opposite the said optical sensor; and external electrical connection means () are located on an exposed part of the said support plate.


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