The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2005
Filed:
Dec. 19, 2002
Tsuyoshi Wakisaka, Tokyo, JP;
Naoki Tsukiji, Tokyo, JP;
Masayoshi Seki, Tokyo, JP;
Junji Yoshida, Tokyo, JP;
Yutaka Oki, Tokyo, JP;
Tsuyoshi Wakisaka, Tokyo, JP;
Naoki Tsukiji, Tokyo, JP;
Masayoshi Seki, Tokyo, JP;
Junji Yoshida, Tokyo, JP;
Yutaka Oki, Tokyo, JP;
The Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
A semiconductor laser element is fixed onto a submount by forming a metallic thin film at a region on a surface of a p-side electrode of the semiconductor laser element. A periphery of the thin metallic thin film is recessed from a periphery of the p-side electrode by a predetermined width. The metallic thin film is thermally processed together with the p-side electrode for increasing a size of the grains and connected through a solder layer to the submount. Parts of the p-side electrode and the submount, the metallic thin film and the solder layer include Au for improving a cushion function of the semiconductor laser device.