The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2005

Filed:

Feb. 19, 2003
Applicants:

Chao-chieh Tsai, Hsin-Chu, TW;

Shih Chih Wong, Taichung, TW;

Inventors:

Chao-Chieh Tsai, Hsin-Chu, TW;

Shih Chih Wong, Taichung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/552 ; H01L021/00 ;
U.S. Cl.
CPC ...
Abstract

Described is a method wherein a seal ring is formed by patterning multiple layers each comprised of a dielectric layer with conductive vias covered by a conductive layer. Discontinuities are made in the seal ring encapsulating an integrated circuit. There are no overlaps between different sections of the seal ring thereby reducing coupling of high frequency circuits in the seal ring structures. In addition, the distance between signal pads, circuits and the seal ring are enlarged. Electrical connection is made between deep N-wells and the seal ring. This encapsulates the integrated circuit substrate and reduces signal coupling with the substrate.


Find Patent Forward Citations

Tsai, Chao-Chieh. (2005). Seal ring structure for radio frequency integrated circuits (U.S. Patent No. 6967392). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6967392

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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