The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2005
Filed:
Jul. 10, 2003
Shinji Kobayashi, Kikuchi-gun, JP;
Takahiro Kitano, Kikuchi-gun, JP;
Shinichi Sugimoto, Kikuchi-gun, JP;
Shinji Kobayashi, Kikuchi-gun, JP;
Takahiro Kitano, Kikuchi-gun, JP;
Shinichi Sugimoto, Kikuchi-gun, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q, and thereafter, it is performed based on a second flow rate set value larger than Q. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q, and more active evaporation of a solvent component is attained by switching to Q