The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2005
Filed:
Aug. 23, 2002
Makoto Yoshino, Beppu, JP;
Kunio Sakamoto, Oita, JP;
Kensho Murata, Beppu, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A semiconductor device designed to reduce the warp of a substrate due to curing contraction, etc. of an insulation pattern while forming the insulation pattern on the surface of a substrate so that it may be interposed between a semiconductor chip and a conductor pattern by offering a semiconductor chip mounting substrate equipped with a flexible substrate(insulating film) having a chip mounting regionfor mounting a semiconductor chipvia an adhesive, conductor patternsthat are formed on the surface of the above-mentioned substrateand electrically connected to the semiconductor chipin an external region of the above-mentioned chip mounting region, and an insulation patternformed on the surface of the substrateand partially in the chip mounting regionso that it may be interposed between the semiconductor chipand the conductor patterns