The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6965156 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 15, 2005

Filed:

Dec. 27, 2002
Applicants:

Frank W. Hawley, Campbell, CA (US);

A. Farid Issaq, Campbell, CA (US);

John L. Mccollum, Saratoga, CA (US);

Shubhra M. Gangopadhyay, Lubbock, TX (US);

Jorge A. Lubguban, Lubbock, TX (US);

Jin Miao Shen, Austin, TX (US);

Inventors:

Frank W. Hawley, Campbell, CA (US);

A. Farid Issaq, Campbell, CA (US);

John L. McCollum, Saratoga, CA (US);

Shubhra M. Gangopadhyay, Lubbock, TX (US);

Jorge A. Lubguban, Lubbock, TX (US);

Jin Miao Shen, Austin, TX (US);

Assignees:

Actel Corporation, Mountain View, CA (US);

Texas Tech University System, Lubbock, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L029/00 ;
U.S. Cl.
CPC ...
Abstract

A metal-to-metal antifuse having a lower metal electrode, a lower thin adhesion promoting layer disposed over the lower metal electrode, an amorphous carbon antifuse material layer disposed over the thin adhesion promoting layer, an upper thin adhesion promoting layer disposed over said antifuse material layer, and an upper metal electrode. The thin adhesion promoting layers are about 2 angstroms to 20 angstroms in thickness, and are from a material selected from the group comprising SiCand SiN. The ratio of x to y in SiCis in a range of about 1+/−0.4, and the ratio of x to y in SiNis in a range of about 0.75+/−0.225.


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