The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6965155 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 15, 2005

Filed:

Jun. 24, 2003
Applicant:

Yasuhiro Fukaura, Yokohama, JP;

Inventor:

Yasuhiro Fukaura, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L029/00 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes: an element isolation region in a semiconductor substrate; an active area in the semiconductor substrate; an interlayer insulation film on the element isolation region and the active area; an opening to which the element isolation region, the active area and a boundary therebetween are exposed; a glue layer in the opening; and a conductor on the glue layer. The element isolation region isolates the active area in the semiconductor substrate, and the active area overlaps a top surface of the isolation region.


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Fukaura, Yasuhiro. (2005). Semiconductor device with glue layer in opening (U.S. Patent No. 6965155). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6965155

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