The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2005
Filed:
Feb. 17, 2004
Chin Chen Kuo, Taipei, TW;
Chih-kung Chang, Hsin-chu, TW;
Hung-jen Hsu, Taoyuan, TW;
Fu-tien Weng, Hsin-Chu, TW;
Te-fu Tseng, Hsin Chu, TW;
Chin Chen Kuo, Taipei, TW;
Chih-Kung Chang, Hsin-chu, TW;
Hung-Jen Hsu, Taoyuan, TW;
Fu-Tien Weng, Hsin-Chu, TW;
Te-Fu Tseng, Hsin Chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited metal has a height near to a height of the planarization layer. At least one color resist layer is formed above the planarization layer.