The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2005
Filed:
Sep. 10, 2002
Alexander Paterson, San Jose, CA (US);
Valentin N. Todorov, Fremont, CA (US);
Jon Mcchesney, San Ramon, CA (US);
Gerhard M. Schneider, Cupertino, CA (US);
David Palagashvili, Mountain View, CA (US);
John P. Holland, San Jose, CA (US);
Michael S. Barnes, San Ramon, CA (US);
Alexander Paterson, San Jose, CA (US);
Valentin N. Todorov, Fremont, CA (US);
Jon McChesney, San Ramon, CA (US);
Gerhard M. Schneider, Cupertino, CA (US);
David Palagashvili, Mountain View, CA (US);
John P. Holland, San Jose, CA (US);
Michael S. Barnes, San Ramon, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method and apparatus for processing wafers including a chamber defining a plurality of isolated processing regions. The isolated processing regions have an upper end and a lower end. The chamber further includes a plurality of plasma generation devices each disposed adjacent the upper end of each isolated processing region, and one of a plurality of power supplies connected to each plasma generation device. The output frequency of the plurality of power supplies are phase and/or frequency locked together. Additionally, the chamber includes a plurality of gas distribution assemblies. Each gas distribution assembly is disposed within each isolated processing region. A movable wafer support is disposed within each isolated processing region to support a wafer for plasma processing thereon. The movable wafer support includes a bias electrode coupled to a bias power supply configured to control the bombardment of plasma ions toward the movable wafer support.