The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2005
Filed:
Apr. 17, 2002
Giles Humpston, San Jose, CA (US);
Yoshikatsu Ichimura, Tokyo, JP;
Nancy M. Mar, Mountain View, CA (US);
Daniel J. Miller, San Francisco, CA (US);
Michael J. Nystrom, San Jose, CA (US);
Heidi L. Reynolds, Palo Alto, CA (US);
Gary R. Trott, San Mateo, CA (US);
Giles Humpston, San Jose, CA (US);
Yoshikatsu Ichimura, Tokyo, JP;
Nancy M. Mar, Mountain View, CA (US);
Daniel J. Miller, San Francisco, CA (US);
Michael J. Nystrom, San Jose, CA (US);
Heidi L. Reynolds, Palo Alto, CA (US);
Gary R. Trott, San Mateo, CA (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.