The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2005
Filed:
Nov. 01, 2002
Younes Achkire, Los Gatos, CA (US);
Alexander Lerner, San Jose, CA (US);
Boris T. Govzman, Sunnyvale, CA (US);
Boris Fishkin, San Carlos, CA (US);
Michael Sugarman, San Francisco, CA (US);
Rashid Mavliev, Campell, CA (US);
Haoquan Fang, San Jose, CA (US);
Shijian LI, San Jose, CA (US);
Guy Shirazi, Mountain View, CA (US);
Jianshe Tang, San Jose, CA (US);
Younes Achkire, Los Gatos, CA (US);
Alexander Lerner, San Jose, CA (US);
Boris T. Govzman, Sunnyvale, CA (US);
Boris Fishkin, San Carlos, CA (US);
Michael Sugarman, San Francisco, CA (US);
Rashid Mavliev, Campell, CA (US);
Haoquan Fang, San Jose, CA (US);
Shijian Li, San Jose, CA (US);
Guy Shirazi, Mountain View, CA (US);
Jianshe Tang, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.