The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Jun. 04, 2004
Applicants:
Vincent Merigot, Hsinchu, TW;
Ming Hsien Tsai, Taipei, TW;
Inventors:
Vincent Merigot, Hsinchu, TW;
Ming Hsien Tsai, Taipei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor apparatus includes a substrate with a peripheral edge. A plurality of devices are situated on the substrate and adjacent the peripheral edge, with each device including a first end adjacent the peripheral edge and a second end opposite the first end. A connector port is located between the first end and the second end on each device. A bonding pad is situated atop a portion of each device and coupled to each device by a connector connected to the connector port. Each connector has a connection path of approximately equal length.