The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2005

Filed:

Dec. 18, 2000
Applicants:

Masaaki Shimagaki, Otsu, JP;

Hisashi Minamiguchi, Otsu, JP;

Masami Ohta, Moriyama, JP;

Inventors:

Masaaki Shimagaki, Otsu, JP;

Hisashi Minamiguchi, Otsu, JP;

Masami Ohta, Moriyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B001/00 ;
U.S. Cl.
CPC ...
Abstract

A polishing pad characterized by having a mechanism for supplying water to the plane of the polishing pad in contact with the article to be polished, in particular, in case the mechanism comprises a domain structure having an area of 1×10mor smaller, reduces the generation of scratches and the dust adhesion on the surface of the article to be polished, while increasing polishing rate at low dishing and erosion; hence, the product is applicable to the field of surface polishing of semiconductor thin films.


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