The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2005

Filed:

Sep. 20, 2000
Applicants:

Neil J. Goldfine, Newton, MA (US);

Darrell E. Schlicker, Watertown, MA (US);

Andrew P. Washabaugh, Chula Vista, CA (US);

Vladimir A. Zilberstein, Chestnut Hill, MA (US);

Vladimir Tsukernik, West Roxbury, MA (US);

Inventors:

Neil J. Goldfine, Newton, MA (US);

Darrell E. Schlicker, Watertown, MA (US);

Andrew P. Washabaugh, Chula Vista, CA (US);

Vladimir A. Zilberstein, Chestnut Hill, MA (US);

Vladimir Tsukernik, West Roxbury, MA (US);

Assignee:

JENTEK Sensors, Inc., Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N027/82 ; G01N027/72 ; G01R033/12 ;
U.S. Cl.
CPC ...
Abstract

Inductive sensors measure the near surface properties of conducting and magnetic material. A sensor may have primary windings with parallel extended winding segments to impose a spatially periodic magnetic field in a test material. Those extended portions may be formed by adjacent portions of individual drive coils. Sensing elements provided every other half wavelength may be connected together in series while the sensing elements in adjacent half wavelengths are spatially offset. Certain sensors include circular segments which create a circularly symmetric magnetic field that is periodic in the radial direction. Such sensors are particularly adapted to surround fasteners to detect cracks and can be mounted beneath a fastener head. In another sensor, sensing windings are offset along the length of parallel winding segments to provide material measurements over different locations when the circuit is scanned over the test material. The distance from the sensing elements to the ends of the primary winding may be kept constant as the offset space in between sensing elements is varied. An image of the material properties can be provided as the sensor is scanned across the material.


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