The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2005
Filed:
Oct. 31, 2002
William H. Lytle, Chandler, AZ (US);
Owen Fay, Gilbert, AZ (US);
Steven Markgraf, Plymouth, MN (US);
Stephen B. Springer, Mesa, AZ (US);
William H. Lytle, Chandler, AZ (US);
Owen Fay, Gilbert, AZ (US);
Steven Markgraf, Plymouth, MN (US);
Stephen B. Springer, Mesa, AZ (US);
Freescale Semiconductor, Inc., Schaumburg, IL (US);
Abstract
A method is disclosed for encapsulating micromechanical elements or features on a substrate. In accordance with the method, a first substrate () is provided which has a patterned surface (). A seed metallization () is then deposited onto the patterned surface, and a structural material layer (), which preferably comprises copper, is electroplated onto the seed metallization. A solder (), such as SnCu, is electroplated onto the metal layer, and the seed metallization, the structural material layer and the solder are removed from the first substrate as a cohesive structure (), through the application of heat or by other suitable means, such that a negative replica of the patterned surface is imparted to the structure. The structure may then be placed on a second substrate () such that the solder is in contact with the second substrate, after which the solder is reflowed. Prior to reflow, the solder may be exposed to a fluorinated plasma, which forms a dry flux on the solder surface in the form of fluorinated metal oxides.