The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2005
Filed:
Jan. 17, 2003
Chong Hao Chen, Singapore, SG;
Wei Liu, Singapore, SG;
Ka Shing Kenny Kwan, Singapore, SG;
ASM Technology Singapore PTE LTD, Singapore, SG;
Abstract
The invention provides an apparatus and method to calibrate a clamp, such as a wire clamp, which is suitable for use with a wire-bonding machine for semiconductor devices. A contact means is arranged to be contacted by an arm of the clamping device and a sensing mechanism is positioned in operational relationship with the arm. An indexing means is adapted to change positions of the clamping device relative to the contact means incrementally as said arm maintains contact with the contact means. The sensing mechanism is capable of sensing feedback from said arm at various positions of the clamping device relative to the contact means. The apparatus is particularly suitable for measuring a clamping force and/or a clamping gap between clamping arms of the clamping device.