The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2005

Filed:

May. 28, 2004
Applicants:

Hien-minh Huu Le, San Jose, CA (US);

Hoa T. Kieu, Sunnyvale, CA (US);

Inventors:

Hien-Minh Huu Le, San Jose, CA (US);

Hoa T. Kieu, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/31 ; C23C014/08 ;
U.S. Cl.
CPC ...
Abstract

A method of depositing a dielectric film, such as tantalum oxide, on a substrate is described. In one example, a substrate is placed in a process zone to face a metal target and a pulsed DC voltage is applied to the target. A sputtering gas comprising a non-reactive component and an oxygen-containing component is introduced to the process zone in a volumetric flow ratio selected to achieve the desired x and y values in the deposited dielectric film, for example, in the deposition of a non-stoichiometric TaOfilm or in the deposition of a tantalum oxide film in which the oxidation state of tantalum is less than +5. The sputtering gas is removed from the process zone by condensing at least some of the non-reactive component on a cooled surface external to the process zone, and exhausting at least some of the oxygen-containing component from the process zone with moving rotors. A multiple layer dielectric film having different stoichiometric ratios in the layers can also be deposited by the instant method.


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