The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Apr. 22, 2004
Applicant:
Young Wook Heo, Phoenix, AZ (US);
Inventor:
Young Wook Heo, Phoenix, AZ (US);
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/48 ; H01L021/50 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor package and method for producing the same has a substrate. A prepackaged semiconductor device is coupled to the substrate. At least one die is coupled to a top surface of the prepackaged semiconductor device. An adhesive layer is laid between the prepackaged semiconductor device and the first die to coupled the two together. A mold compound is then used to encapsulate the semiconductor package.
Heo, Young. (2005). Semiconductor package having one or more die stacked on a prepackaged device and method therefor (U.S. Patent No. 6946323). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6946323
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile