The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Jun. 14, 2004
Michael D. Camras, Sunnyvale, CA (US);
Daniel A. Steigerwald, Cupertino, CA (US);
Frank M. Steranka, San Jose, CA (US);
Michael J. Ludowise, San Jose, CA (US);
Paul S. Martin, Pleasanton, CA (US);
Michael R. Krames, Mountain View, CA (US);
Fred A. Kish, San Jose, CA (US);
Stephen A. Stockman, Morgan Hill, CA (US);
Michael D. Camras, Sunnyvale, CA (US);
Daniel A. Steigerwald, Cupertino, CA (US);
Frank M. Steranka, San Jose, CA (US);
Michael J. Ludowise, San Jose, CA (US);
Paul S. Martin, Pleasanton, CA (US);
Michael R. Krames, Mountain View, CA (US);
Fred A. Kish, San Jose, CA (US);
Stephen A. Stockman, Morgan Hill, CA (US);
Lumileds Lighting U.S., LLC, San Jose, CA (US);
Abstract
A light-emitting semiconductor device includes a stack of layers including an active region. The active region includes a semiconductor selected from the group consisting of III-Phosphides, III-Arsenides, and alloys thereof. A superstrate substantially transparent to light emitted by the active region is disposed on a first side of the stack. First and second electrical contacts electrically coupled to apply a voltage across the active region are disposed on a second side of the stack opposite to the first side. In some embodiments, a larger fraction of light emitted by the active region exits the stack through the first side than through the second side. Consequently, the light-emitting semiconductor device may be advantageously mounted as a flip chip to a submount, for example.