The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Feb. 10, 2004
Timothy W. Budell, Milton, VT (US);
Eric W. Tremble, Jericho, VT (US);
Brian P. Welch, Scotia, NY (US);
Timothy W. Budell, Milton, VT (US);
Eric W. Tremble, Jericho, VT (US);
Brian P. Welch, Scotia, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention provides a redistribution package having an upper surface that includes contacts with reduced pitch that correspond, for example, to that of a Controlled Collapse Chip Connection ('C4') structure formed on a chip, and a lower surface having contacts with increased pitch that correspond, for example, to a printed circuit board employing ball grid array ('BGA') pads. A series of power, signal and ground conductors extend through the body of the redistribution package and interconnect the circuit board contacts to the chip contacts.