The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Jan. 08, 2004
Yoshihiko Shimanuki, Nanyo, JP;
Yoshihiko Shimanuki, Nanyo, JP;
Renesas Technology Corp., Tokyo, JP;
Hitachi Yonezawa Electronics Co., Ltd., Yamagata, JP;
Abstract
The semiconductor device includes tubthat is smaller than semiconductor chip, and which supports semiconductor chip; molded sectionthat is formed by resin-molding around semiconductor chip; suspension leads, including supporting portionsthat support tuband exposed portionsthat are connected to supporting portionsand are exposed on back surfaceof molded section, and are elevation processed in supporting portions; leadsthat are located around tub; and wiresthat connect padsof the semiconductor chipwith the corresponding leads; wherein the thickness of tuband supporting portionsof suspension leadsis less than the thickness of exposed portions, and back surfaceof semiconductor chipis firmly in contact with molding resin