The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Mar. 05, 2004
Applicant:
Kollengode Subramanian Narayanan, Cupertino, CA (US);
Inventor:
Kollengode Subramanian Narayanan, Cupertino, CA (US);
Assignee:
NetLogic Microsystems, Inc., Mountain View, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/488 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor package with solder bumps and a method for making the same are described. One embodiment comprises a flip-chip design with a rectangular semiconductor die with a relatively large aspect ratio bonded to a substantially square substrate through solder bumps. In one embodiment, active bumps are concentrated in an area relatively close to the neutral point of the die, for example, in a substantially square area about the neutral point.