The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Feb. 27, 2003
Masahiko Kitamura, Tokyo, JP;
Masatoshi Nanjo, Tokyo, JP;
Kouichi Yajima, Tokyo, JP;
Shinichi Namioka, Tokyo, JP;
Masahiko Kitamura, Tokyo, JP;
Masatoshi Nanjo, Tokyo, JP;
Kouichi Yajima, Tokyo, JP;
Shinichi Namioka, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A semiconductor wafer protecting unit which enables a semiconductor wafer to be handled as required, without breakage of the semiconductor wafer, even when the back of the semiconductor wafer is ground to decrease the thickness of the semiconductor wafer markedly; and a semiconductor wafer processing method using such a semiconductor wafer protecting unit. The semiconductor wafer protecting unit is composed of a magnetized tape having one surface with tackiness, and a magnetic substrate having many pores formed at least in a central zone thereof.