The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Mar. 21, 2001
Hiroshi Yagi, Tokyo, JP;
Shigeki Kawano, Tokyo, JP;
Kazuo Umeda, Tokyo, JP;
Jiro Takei, Tokyo, JP;
Yukio Iimura, Tokyo, JP;
Satoshi Sasaki, Tokyo, JP;
Katsuya Sakayori, Tokyo, JP;
Hiroko Amasaki, Tokyo, JP;
Hiroshi Yagi, Tokyo, JP;
Shigeki Kawano, Tokyo, JP;
Kazuo Umeda, Tokyo, JP;
Jiro Takei, Tokyo, JP;
Yukio Iimura, Tokyo, JP;
Satoshi Sasaki, Tokyo, JP;
Katsuya Sakayori, Tokyo, JP;
Hiroko Amasaki, Tokyo, JP;
Dainippon Printing Co., Ltd., Tokyo, JP;
Abstract
A wireless suspension blank is made using a two-layer laminate composed of a metallic layer with the spring property and an electrically insulating layer. The first method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the wet-etching method. The second method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the plasma etching method. The third method includes a first step for forming a wiring part on the metallic layer by the semi-additive method, a second step for working the metallic layer by the wet-etching method and a third step for working the insulating layer by the dry-etching method or the wet-etching method. The use of a two-layer laminate makes possible a low cost production. Further, the forming of a wiring part by the semi-additive method makes possible to working very accurately a fine wiring part.