The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
May. 31, 2000
Carlo Zavattari, Novara, IT;
Ferdinando Severico, Novara, IT;
Paolo DE Maria, Novara, IT;
MEMC Electronic Materials, S.p.A., Novara, IT;
Abstract
A wire saw () for simultaneously slicing multiple, generally cylindrical monocrystalline ingots () into wafers. The wire saw includes a cutting head (), an ingot support (), and multiple generally parallel lengths of cutting wire () defining a cutting web (). A slurry delivery system includes nozzles (, and) positioned for dispensing slurry along the wire web generally at lateral sides of each ingot. A process for simultaneously slicing at least two generally cylindrical semiconductor ingots into wafers includes mounting at least two ingots to a common ingot support, moving the ingot support relative to the cutting web so that the two ingots simultaneously press against the cutting web at cutting regions, and dispensing a liquid slurry to at least three locations on the wire web including two outermost sides of the cutting regions and a location between each pair of ingots.