The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Nov. 07, 2001
Jonathan W. Lai, Goleta, CA (US);
Hector B. Cavazos, Santa Barbara, CA (US);
Stephen C. Minne, Danville, IL (US);
Dennis M. Adderton, Santa Barbara, CA (US);
Jonathan W. Lai, Goleta, CA (US);
Hector B. Cavazos, Santa Barbara, CA (US);
Stephen C. Minne, Danville, IL (US);
Dennis M. Adderton, Santa Barbara, CA (US);
Veeco Instruments Inc., Woodbury, NY (US);
Abstract
A method to compensate for stress deflection in a compound microprobe that includes a substrate, a microcantilever extending outwardly from the substrate, and a film formed on the microcantilever. The method preferably comprises the steps of determining an amount of stress-induced deflection of the microcantilever, and then mounting the microprobe so as to compensate for the stress-induced deflection. The mounting step preferably includes selecting a compensation piece based upon the amount of stress-induced deflection, where the compensation piece is a wedge generally aligning the microcantilever with a deflection detection apparatus. In general, the step of selecting the compensation piece includes correcting an angle between a longitudinal axis of the microcantilever and the substrate so as to insure that light reflected from the microcantilever during operation contacts a detector of a deflection detection apparatus. The preferred embodiment is also directed to a microprobe assembly having a microcantilever and a substrate coupled to a support that includes a compensation piece disposed intermediate the support and the substrate. Again, the compensation piece is configured to compensate for an amount of static deflection of the microcantilever.