The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Oct. 03, 2003
Alan J. Jensen, Troutdale, OR (US);
Mario Stella, Bedlington, GB;
Eugene Zhao, San Jose, CA (US);
Peter Renteln, San Ramon, CA (US);
Jeffrey Farber, Delmar, NY (US);
Alan J. Jensen, Troutdale, OR (US);
Mario Stella, Bedlington, GB;
Eugene Zhao, San Jose, CA (US);
Peter Renteln, San Ramon, CA (US);
Jeffrey Farber, Delmar, NY (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A method and apparatus for pre-conditioning a polishing pad for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-conditioning member having a smooth surface, pressing the pre-conditioning member against the polishing pad while moving the polishing pad, and flattening the surface of the polishing pad until a polishing pad flatness is achieved that may be used to achieve a desired semiconductor wafer planarity.