The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
Sep. 25, 2002
Masami Kimura, Chiba, JP;
Susumu Shimada, Nagano, JP;
Masami Kimura, Chiba, JP;
Susumu Shimada, Nagano, JP;
Dowa Mining, Co. Ltd., Tokyo, JP;
Abstract
There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plateof an overall-rate solid solution type alloy on a ceramic substrateand heating the metal plateand the ceramic substratein a non-oxidizing atmosphere at a temperature of lower than a melting point of the alloy to bond the metal platedirectly to the ceramic substrate. According to this method, it is possible to easily bond an alloy plate directly to a ceramic substrate, and it is possible to inexpensively provide an electronic member for resistance without causing the alloy plate to be deteriorated.