The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
Apr. 15, 2003
Tadatomo Suga, Nakano-ku, Tokyo, JP;
Keisuke Saito, Yokohama, JP;
Yoshikazu Matsuura, Miki, JP;
Tatsuya Takeuchi, Kobe, JP;
Johji Kagami, Kobe, JP;
Rikiya Kato, Souka, JP;
Sakie Yamagata, Souka, JP;
Tadatomo Suga, Nakano-ku, Tokyo, JP;
Keisuke Saito, Yokohama, JP;
Yoshikazu Matsuura, Miki, JP;
Tatsuya Takeuchi, Kobe, JP;
Johji Kagami, Kobe, JP;
Rikiya Kato, Souka, JP;
Sakie Yamagata, Souka, JP;
Abstract
A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.