The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
May. 20, 2002
Applicants:
Chung Ju Wu, Kaohsiung, TW;
Kuei Chen Liang, Hsinchu, TW;
Wei Feng Lin, Hsinchu, TW;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract
The invention provides a semiconductor package substrate, which includes a substrate, a chip contact area, an inner pad portion, an outer pad portion and a conductive layer. The chip contact area, the inner pad portion, the outer pad portion and the conductive layer are formed on one side of the substrate, wherein the outer pad portion encloses the inner pad portion that surrounds the chip contact area in the center of the substrate. The inner pad portion and the outer pad portion contain a plurality of signal pads and a plurality of shielding pads respectively, while the conductive layer and each of the shielding pads are electrically connected.