The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Apr. 08, 2004
Nikhil Kelkar, San Jose, CA (US);
Ken Pham, San Jose, CA (US);
Jaime A. Bayan, Palo Alto, CA (US);
Cheol Hyun Han, Fremont, CA (US);
Nikhil Kelkar, San Jose, CA (US);
Ken Pham, San Jose, CA (US);
Jaime A. Bayan, Palo Alto, CA (US);
Cheol Hyun Han, Fremont, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A post singulation, die separation assembly for bulk separation of a plurality of dice in a singulated wafer from the adhesive backing of wafer saw tape. The die separation assembly includes a support base having a support surface, a first portion and an opposite second portion thereof. The second portion includes a down-ramped portion thereof skewed downwardly at a first acute angle from the support surface. A feed tray includes a collection end positioned adjacent the base second portion such that an elongated, substantially thin gap is formed between the tray collection end and at least a portion of the base second portion. A flexible platform is movably supported atop the base support surface for movement from the first portion to the second portion thereof. At the second portion, the platform passes downward through the gap formed between the tray collection end and the at least a portion of the base second portion. The platform defines an upward facing surface upon each die of the singulated wafer is adhered thereto, via the saw tape, in a forward aligned manner. Upon movement of the flexible platform down the down-ramped portion of the support base, a portion of the wafer saw tape thereat is peeled away from the respective die. The tape is the separated from the dice, releasing the respective dice onto the collection end of the feed tray in a manner substantially maintaining their forward alignment orientation of thereof.