The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Jan. 09, 2003
Yasuhiro Sugaya, Osaka, JP;
Koichi Hirano, Hirakata, JP;
Seiichi Nakatani, Hirakata, JP;
Yasuyuki Matsuoka, Neyagawa, JP;
Satoru Yuuhaku, Osaka, JP;
Toshiyuki Asahi, Osaka, JP;
Yasuhiro Sugaya, Osaka, JP;
Koichi Hirano, Hirakata, JP;
Seiichi Nakatani, Hirakata, JP;
Yasuyuki Matsuoka, Neyagawa, JP;
Satoru Yuuhaku, Osaka, JP;
Toshiyuki Asahi, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in moduleincludes the insulating substratemade of a first mixtureand a second mixture, wiring patternsandformed on one principal surface and another principal surface of the insulating substrate, a circuit componentelectrically connected to the wiring patternand sealed with the second mixturein an internal portion of the insulating substrate, the inner via conductorelectrically connecting the wiring patternand