The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Dec. 03, 2001
Applicants:
Satoru Tomekawa, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Takeshi Suzuki, Osaka, JP;
Yoshihiro Kawakita, Osaka, JP;
Tadashi Nakamura, Osaka, JP;
Inventors:
Satoru Tomekawa, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Takeshi Suzuki, Osaka, JP;
Yoshihiro Kawakita, Osaka, JP;
Tadashi Nakamura, Osaka, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ; H01L029/40 ;
U.S. Cl.
CPC ...
Abstract
A connecting strength at a bonding site between a wiring layerand a conductoris enhanced by comparing a bonding strength between a wiring layerprovided by covering the conductoron an insulating baseand the conductorwith a bonding strength between the wiring layerand the insulating basein an adjacency of the conductor to set the latter relatively lower.