The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Jul. 23, 2001
Yutaka Kaneda, Kanuma, JP;
Akira Tsutsumi, Kanuma, JP;
Hiroyuki Hishinuma, Kanuma, JP;
Sony Chemicals Corp., Tokyo, JP;
Abstract
An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps. A resin coatingand a resist filmare formed in this order on the surface of a metal filmand on the surface of each metal bumpformed on the metal film, and a pressure is applied on the surface to depress the resist filmon the metal bump, followed by etching. As the surface of the resin coatingis partially exposed at the depressed portion of the resist film, etching of the resin coatingproceeds from that portion to bulge the surface of the metal bumpfrom the resin coating. If the resist filmis formed after a flexible resin coatingis formed on the rigid resin coating, the flexible resin coatingcan serve as an adhesive layer.