The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Aug. 25, 2003
Shinji Takase, Kyoto, JP;
Takashi Tamura, Kyoto, JP;
Yohei Onishi, Kyoto, JP;
Towa Corporation, Kyoto, JP;
Abstract
A substrate with a plurality of semiconductor chips mounted thereon is set in a die. The die is then clamped. The die thus clamped forms a space, into which resin is introduced. In doing so, a member is provided to fill a gap between an upper surface of each chip and the die. The member is elastic and thus elastically deforms when the die is clamped. Thus from the elastic member to each chip's upper surface a substantially uniform pressure is exerted. The elastic member is a film extending substantially parallel to each chip's upper surface and contacts the upper surface as the member is tensioned in its in-plane direction. The above resin introduction step can prevent the semiconductor chip from having an upper surface with resin flash.