The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2005

Filed:

May. 27, 2003
Applicants:

Richard Allen Faust, Dallas, TX (US);

Jiong-ping LU, Richardson, TX (US);

Inventors:

Richard Allen Faust, Dallas, TX (US);

Jiong-Ping Lu, Richardson, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/4763 ;
U.S. Cl.
CPC ...
Abstract

According to one embodiment of the invention, a method for providing improved layer adhesion in a semiconductor is provided. The method includes forming a dielectric layer. The method also includes forming a layer of metal in direct contact with the dielectric layer. The method also includes directly exposing the layer of metal, after forming the layer of metal, to plasma at a power level sufficient to penetrate through the layer of metal and reach the dielectric layer.


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