The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2005

Filed:

May. 14, 2004
Applicants:

Cheng-chih Huang, Taipei, TW;

Sheng-wei Yang, Taipei, TW;

Neng-tai Shih, Taipei, TW;

Chen-chou Huang, Taipei, TW;

Inventors:

Cheng-Chih Huang, Taipei, TW;

Sheng-Wei Yang, Taipei, TW;

Neng-Tai Shih, Taipei, TW;

Chen-Chou Huang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/8242 ; H01L021/20 ;
U.S. Cl.
CPC ...
Abstract

A method for forming a self-aligned buried strap in a vertical memory cell. A semiconductor substrate with a trench is provided, a capacitor wire is formed on the bottom portion of the trench, and a collar dielectric layer is formed between the capacitor wire and the semiconductor substrate to act as an isolation. The capacitor wire and the collar dielectric layer are etched to a predetermined depth, such that a gap is formed between the spacer and the capacitor wire and the collar dielectric layer. Ions are doped into the exposed semiconductor substrate to form an ion doped area acting as a buried strap. The spacer is removed, and an exposed collar dielectric layer is etched below the level of the surface of the capacitor wire, and a groove is formed between the capacitor wire and the trench sidewall to fill with a conducting layer.


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