The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Nov. 29, 2001
Toshihiko Taguchi, Saitama, JP;
Kunihito Takaura, Mouka, JP;
Setsuko Tadokoro, Mouka, JP;
Masahiko Hirata, Kashiba, JP;
Hisahiko Yoshida, Ibaraki, JP;
Takashi Nagashima, Kyoto, JP;
Toshihiko Taguchi, Saitama, JP;
Kunihito Takaura, Mouka, JP;
Setsuko Tadokoro, Mouka, JP;
Masahiko Hirata, Kashiba, JP;
Hisahiko Yoshida, Ibaraki, JP;
Takashi Nagashima, Kyoto, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Abstract
A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01-10.0 wt % of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.