The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Aug. 07, 2002
Yuichi Satsu, Hitachi, JP;
Akio Takahashi, Hitachiohta, JP;
Tadashi Fujieda, Mito, JP;
Takumi Ueno, Mito, JP;
Haruo Akahoshi, Hitachi, JP;
Yuichi Satsu, Hitachi, JP;
Akio Takahashi, Hitachiohta, JP;
Tadashi Fujieda, Mito, JP;
Takumi Ueno, Mito, JP;
Haruo Akahoshi, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.