The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Nov. 10, 2003
System for testing one or more groups of ic-chips while concurrently loading/unloading another group
Randy Neaman Siade, Chandler, AZ (US);
Terry Sinclair Connacher, Scottsdale, AZ (US);
James Vernon Rhodes, Chandler, AZ (US);
James Mason Brafford, Mission Viejo, CA (US);
John Charles Montgomery, Poway, CA (US);
David Jon Mortensen, Mission Viejo, CA (US);
Randy Neaman Siade, Chandler, AZ (US);
Terry Sinclair Connacher, Scottsdale, AZ (US);
James Vernon Rhodes, Chandler, AZ (US);
James Mason Brafford, Mission Viejo, CA (US);
John Charles Montgomery, Poway, CA (US);
David Jon Mortensen, Mission Viejo, CA (US);
Unisys Corporation, Blue Bell, PA (US);
Abstract
An electromechanical system for testing IC-chips includes a total of N chip holding subassemblies, where N is an integer greater than one and where each chip holding subassembly has sockets for holding a group of IC-modules that include the IC-chips; a moving mechanism for automatically moving the i-th chip holding subassembly from a load position in the system to a test position in the system, and visa-versa, where i ranges from 1 to N and changes with time in a sequence; and a temperature control mechanism which contacts the IC-modules at the test position. Between the moving of the i-th chip holding subassembly and the next chip holding subassembly in the sequence, the IC-chips are burn-in tested on all N of the chip holding subassemblies. Also, while the i-th chip holding subassembly is being moved, burn-in testing of IC-chips on the remaining N-1 chip holding subassemblies continues.