The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Jun. 02, 2004
Sang-wook Park, Seoul, KR;
Jae-min Yu, Seoul, KR;
Chul-soon Kwon, Seoul, KR;
Jin-woo Kim, Suwon-si, KR;
Jae-hyun Park, Yongin-si, KR;
Yong-hee Kim, Suwon-si, KR;
Don-woo Lee, Gyeonggi-do, KR;
Dai-geun Kim, Suwon-si, KR;
Joo-chan Kim, Seoul, KR;
Kook-min Kim, Suwon-si, KR;
Eui-youl Ryu, Seongnam-si, KR;
Sang-Wook Park, Seoul, KR;
Jae-Min Yu, Seoul, KR;
Chul-Soon Kwon, Seoul, KR;
Jin-Woo Kim, Suwon-si, KR;
Jae-Hyun Park, Yongin-si, KR;
Yong-Hee Kim, Suwon-si, KR;
Don-Woo Lee, Gyeonggi-do, KR;
Dai-Geun Kim, Suwon-si, KR;
Joo-Chan Kim, Seoul, KR;
Kook-Min Kim, Suwon-si, KR;
Eui-Youl Ryu, Seongnam-si, KR;
Abstract
A semiconductor device having a measuring pattern that enhances measuring reliability and a method of measuring the semiconductor device using the measuring pattern. The semiconductor device includes a semiconductor substrate having a chip area in which an integrated circuit is formed, and a scribe area surrounding the chip area. The semiconductor device also includes a measuring pattern formed in the scribe area and having a surface sectional area to include a beam area in which measuring beams are projected, and a dummy pattern formed in the measuring pattern to reduce the surface sectional area of the measuring pattern. The surface sectional area of the dummy pattern occupies from approximately 5% to approximately 15% of a surface sectional area of the beam area.